Patent Assignment Details
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| Reel/Frame: | 019683/0883 | |
| Pages: | 5 |
| | Recorded: | 08/13/2007 | | |
| Attorney Dkt #: | X2007.0250 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/17/2012
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Application #:
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11837261
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Filing Dt:
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08/10/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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METHOD AND APPARATUS FOR INSPECTION OF WAFER AND SEMICONDUCTOR DEVICE
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Assignee
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| 10-1, NAKAZAWA-CHO |
| NAKA-KU, HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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MICHAEL J. SCHEER
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DICKSTEIN SHAPIRO LLP
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1177 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036
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