Patent Assignment Details
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| Reel/Frame: | 019703/0842 | |
| Pages: | 4 |
| | Recorded: | 08/16/2007 | | |
| Attorney Dkt #: | 072015 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11837734
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Filing Dt:
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08/13/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, PRODUCTION METHOD THEREOF, AND POLISHING METHOD
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Assignees
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| 11-1, KAMEIDO 9-CHOME. KOTO-KU |
| TOKYO, JAPAN |
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| 2647 HAYAKAWA, AYASE-SHI |
| KANAGAWA, JAPAN |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVENUE, NW
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SUITE-700
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WASHINGTON, DC 20036-2657
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