Patent Assignment Details
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| Reel/Frame: | 019756/0612 | |
| Pages: | 2 |
| | Recorded: | 08/28/2007 | | |
| Attorney Dkt #: | Q103539 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11846047
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Filing Dt:
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08/28/2007
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Publication #:
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Pub Dt:
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03/06/2008
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Title:
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METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| OSAKA |
| IBARAKI-SHI, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVE
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WASHINGTON, DC 20037
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