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Reel/Frame:019782/0973   Pages: 2
Recorded: 08/20/2007
Attorney Dkt #:033773 M 231
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11892150
Filing Dt:
08/20/2007
Publication #:
Pub Dt:
02/28/2008
Title:
Wafer dividing method
Assignors
1
Exec Dt:
08/13/2007
2
Exec Dt:
08/13/2007
3
Exec Dt:
08/13/2007
4
Exec Dt:
08/13/2007
Assignee
1
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO 143-8580, JAPAN
Correspondence name and address
MICHAEL A. MAKUCH
SMITH, GAMBRELL & RUSSELL, LLP
1850 M STREET, NW - SUITE 800
WASHINGTON, DC 20036

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