Patent Assignment Details
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| Reel/Frame: | 019820/0563 | |
| Pages: | 4 |
| | Recorded: | 09/12/2007 | | |
| Attorney Dkt #: | P2798US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/2013
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Application #:
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11879464
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Filing Dt:
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07/17/2007
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Publication #:
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Pub Dt:
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01/24/2008
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Title:
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Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board
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Assignee
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| 5-5, MINAMI-HONCHO 1-CHOME |
| JOETSU-SHI, NIIGATA, JAPAN 943-8610 |
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Correspondence name and address
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BRIAN C. RUPP
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DRINKER BIDDLE & REATH LLP
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191 N. WACKER DRIVE
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SUITE 3700
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CHICAGO, IL 60606-1698
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