Patent Assignment Details
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Reel/Frame: | 019952/0007 | |
| Pages: | 2 |
| | Recorded: | 10/04/2007 | | |
Attorney Dkt #: | 049677-0206 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/03/2013
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Application #:
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11664393
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Title:
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Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same
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Assignee
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5-33, KITAHAMA 4-CHOME, CHUO-KU |
OSAKA-SHI, OSAKA, JAPAN 541-0041 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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