Patent Assignment Details
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| Reel/Frame: | 019981/0624 | |
| Pages: | 3 |
| | Recorded: | 10/05/2007 | | |
| Attorney Dkt #: | 5355-0115PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11905947
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Filing Dt:
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10/05/2007
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Publication #:
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Pub Dt:
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04/09/2009
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Title:
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Semiconductor package having restraining ring surfaces against soldering crack
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Assignee
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| NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK |
| HUKOU SHIANG |
| HSINCHU, TAIWAN ROC |
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Correspondence name and address
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JOE MCKINNEY MUNCY
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BIRCH STEWART KOLASCH, ET AL.
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8110 GATEHOUSE ROAD, SUITE 100 EAST
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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