Patent Assignment Details
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| Reel/Frame: | 020002/0108 | |
| Pages: | 3 |
| | Recorded: | 10/23/2007 | | |
| Attorney Dkt #: | 17711 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/07/2009
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Application #:
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11877084
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Filing Dt:
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10/23/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Title:
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SOLDER BALL MOUNTING METHOD AND SOLDER BALL MOUNTING SUBSTRATE MANUFACTURING METHOD
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Assignee
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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RANKIN HILL PORTER AND CLARK
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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05/08/2024 01:35 PM
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