Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 020033/0672 | |
| Pages: | 7 |
| | Recorded: | 10/30/2007 | | |
Attorney Dkt #: | JG-SU-5287/500577.20117 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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11840615
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Filing Dt:
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08/17/2007
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Publication #:
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Pub Dt:
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02/19/2009
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER INCLUDING A STRAINED SILICON LAYER
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Assignees
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2-1 SHIBAURA 1-CHOME |
MINATO-KU |
TOKYO, JAPAN 105-8634 |
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10-1 HAKOZAKI 6-CHOME |
HIGASHI-KU, FUKUOKA-SHI |
FUKUOKA, JAPAN 812-8581 |
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Correspondence name and address
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JULES E. GOLDBERG
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599 LEXINGTON AVENUE, 29TH FLOOR
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REED SMITH, LLP
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NEW YORK, NY 10022
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