Patent Assignment Details
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| Reel/Frame: | 020036/0779 | |
| Pages: | 5 |
| | Recorded: | 10/19/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11907998
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Filing Dt:
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10/19/2007
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Publication #:
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Pub Dt:
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04/24/2008
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Title:
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Manufacturing method of semiconductor device and semiconductor device
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Assignees
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| 6-2, OTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET NW
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WASHINGTON, D.C. 20005-3096
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