Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020100/0068 | |
| Pages: | 3 |
| | Recorded: | 11/13/2007 | | |
| Attorney Dkt #: | 21270/1200835-US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11739498
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Filing Dt:
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04/24/2007
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Publication #:
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Pub Dt:
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02/28/2008
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Title:
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SILICON WAFER ETCHING METHOD AND APPARATUS, AND IMPURITY ANALYSIS METHOD
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Assignee
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| 1-2-1 SHIBAURA, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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Correspondence name and address
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JOSEPH R. ROBINSON
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P.O. BOX 770, CHURCH STREET STATION
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NEW YORK, NY 10008-0770
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