Patent Assignment Details
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Reel/Frame: | 020100/0488 | |
| Pages: | 5 |
| | Recorded: | 11/09/2007 | | |
Attorney Dkt #: | 033946-1801 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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11937210
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Filing Dt:
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11/08/2007
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Publication #:
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Pub Dt:
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09/24/2009
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Title:
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Method of Forming an Interconnect on a Semiconductor Substrate
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Assignee
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50 NANYANG AVENUE, SINGAPORE 639798 |
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Correspondence name and address
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BARRY S. WILSON
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FOLEY & LARDER LLP
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P.O. BOX 80278
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SAN DIEGO, CA 92138-0278
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