Patent Assignment Details
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| Reel/Frame: | 020113/0983 | |
| Pages: | 4 |
| | Recorded: | 11/15/2007 | | |
| Attorney Dkt #: | MEG03-005C2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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11756621
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Filing Dt:
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05/31/2007
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Publication #:
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Pub Dt:
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02/26/2009
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Title:
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WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD., |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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MEGICA CORPORATION
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ROOM 301/302, NO. 47, PARK 2ND RD.,
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HSINCHU, 300 TAIWAN
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