Patent Assignment Details
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| Reel/Frame: | 020120/0402 | |
| Pages: | 6 |
| | Recorded: | 11/15/2007 | | |
| Attorney Dkt #: | P33086 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/13/2014
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Application #:
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11910050
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Filing Dt:
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06/15/2009
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Publication #:
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Pub Dt:
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02/18/2010
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Title:
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Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil
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Assignee
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 1418584 |
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Correspondence name and address
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GREENBLUM & BERNSTEIN, P.L.C.
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1950 ROLAND CLARKE PLACE
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RESTON, VA 20191
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