Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020165/0907 | |
| Pages: | 5 |
| | Recorded: | 11/27/2007 | | |
| Attorney Dkt #: | 1217-074355 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/10/2015
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Application #:
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11945769
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Filing Dt:
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11/27/2007
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Publication #:
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Pub Dt:
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05/29/2008
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Title:
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Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
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Assignee
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| 23-23 HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 1730001 |
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Correspondence name and address
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KENT E. BALDAUF
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PA 15219
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