Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020167/0194 | |
| Pages: | 5 |
| | Recorded: | 11/15/2007 | | |
| Attorney Dkt #: | 0033-1179PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11920421
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Filing Dt:
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11/15/2007
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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Low Adhesion Material, Resin Molding Die, and Soil Resistant Material
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Assignees
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| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI, KYOTO 601-8105, JAPAN |
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| 4-1, MUTSUNO 2-CHOME, ATSUTA-KU |
| NAGOYA-SHI |
| AICHI, JAPAN 456-8587 |
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Correspondence name and address
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CHARLES GORENSTEIN
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BIRCH, STEWART, KOLASCH & BIRCH LLP
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8110 GATEHOUSE ROAD
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SUITE 100 EAST, P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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