Patent Assignment Details
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Reel/Frame: | 020178/0090 | |
| Pages: | 5 |
| | Recorded: | 11/29/2007 | | |
Attorney Dkt #: | 1217-074364 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11915990
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Filing Dt:
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11/29/2007
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Publication #:
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Pub Dt:
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12/24/2009
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Title:
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Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation
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Assignee
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1-11-1, OSAKI |
SHINAGAWA-KU |
TOKYO, JAPAN 141-8584 |
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Correspondence name and address
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THE WEBB LAW FIRM
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436 SEVENTH AVENUE
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700 KOPPERS BUILDING
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PITTSBURGH, PA 15219
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