Patent Assignment Details
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Reel/Frame: | 020209/0085 | |
| Pages: | 3 |
| | Recorded: | 12/06/2007 | | |
Attorney Dkt #: | ALPSP323 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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11952077
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Filing Dt:
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12/06/2007
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Publication #:
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Pub Dt:
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11/27/2008
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Title:
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ELECTRONIC CIRCUIT MODULE INCLUDING CHIP MOUNTED TO MULTI-LAYER WIRING PLATE IN FLIP CHIP MANNER
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Assignee
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1-7 YUKIGAYA, OTSUKA-CHO, OTA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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BEYER WEAVER LLP
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P.O. BOX 70250
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OAKLAND, CA 94612-0250
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