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Reel/Frame:020286/0316   Pages: 2
Recorded: 12/24/2007
Attorney Dkt #:MAS-FIN-177
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/11/2008
Application #:
10132826
Filing Dt:
04/25/2002
Publication #:
Pub Dt:
10/31/2002
Title:
ELECTRONIC COMPONENT WITH SEMICONDUCTOR CHIPS, ELECTRONIC ASSEMBLY COMPOSED OF STACKED SEMICONDUCTOR CHIPS, AND METHODS FOR PRODUCING AN ELECTRONIC COMPONENT AND AN ELECTRONIC ASSEMBLY
Assignors
1
Exec Dt:
04/24/2002
2
Exec Dt:
04/23/2002
Assignee
1
ST.-MARTIN-STR. 53
HOLLYWOOD, GERMANY 81669
Correspondence name and address
LERNER GREENBERG STEMER LLP
P.O. BOX 2480
HOLLYWOOD, FL 33022-2480

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