Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020312/0220 | |
| Pages: | 3 |
| | Recorded: | 12/28/2007 | | |
| Attorney Dkt #: | JCLA21225 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11994324
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Filing Dt:
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12/28/2007
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Publication #:
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Pub Dt:
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08/20/2009
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Title:
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SOLDER ALLOY FOR OXIDE BONDING
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Assignees
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| 4-28, MAEHARA-CHO, 2-CHOME KOGANEI-SHI |
| TOKYO 184-0013, JAPAN |
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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J. C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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