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Reel/Frame:	020354/0632			Pages:	5
		Recorded:	01/11/2008
Attorney Dkt #:	12065-0056 TO DOWA METALT
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 33

Patent #:	6013357	Issue Dt:	01/11/2000	Application #:	08917328	Filing Dt:	08/25/1997
Title:	POWER MODULE CIRCUIT BOARD AND A PROCESS FOR THE MANUFACTURE THEREOF

Patent #:	6221511	Issue Dt:	04/24/2001	Application #:	09036855	Filing Dt:	03/09/1998
Title:	METAL-CERAMIC COMPOSITE SUBSTRATES, PRODUCING METHODS THEREOF AND BRAZING MATERIALS FOR USE IN SUCH METHOD

Patent #:	7348493	Issue Dt:	03/25/2008	Application #:	09848140	Filing Dt:	05/03/2001
Publication #:	US20020050510	Pub Dt:	05/02/2002
Title:	METAL-CERAMIC CIRCUIT BOARD

Patent #:	7276292	Issue Dt:	10/02/2007	Application #:	10087566	Filing Dt:	03/01/2002
Publication #:	US20020164488	Pub Dt:	11/07/2002
Title:	INSULATING SUBSTRATE BOARDS FOR SEMICONDUCTOR AND POWER MODULES

Patent #:	7387741	Issue Dt:	06/17/2008	Application #:	10397429	Filing Dt:	03/27/2003
Publication #:	US20030213773	Pub Dt:	11/20/2003
Title:	POWER MODULE MEMBER MANUFACTURED BY WET TREATMENT, AND WET TREATMENT METHOD AND WET TREATMENT EQUIPMENT THEREOF

Patent #:	7180176	Issue Dt:	02/20/2007	Application #:	10487396	Filing Dt:	05/10/2004
Publication #:	US20040194861	Pub Dt:	10/07/2004
Title:	RADIATION PLATE AND POWER SEMICONDUCTOR MODULE IC PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	10644217	Filing Dt:	08/20/2003
Publication #:	US20050039827	Pub Dt:	02/24/2005
Title:	Copper alloy having excellent corrosion cracking resistance and dezincing resistance, and method for producing same

Patent #:	7351372	Issue Dt:	04/01/2008	Application #:	10667709	Filing Dt:	09/22/2003
Publication #:	US20040140022	Pub Dt:	07/22/2004
Title:	COPPER BASE ALLOY AND METHOD FOR PRODUCING SAME

Patent #:	7256353	Issue Dt:	08/14/2007	Application #:	10747837	Filing Dt:	12/29/2003
Publication #:	US20040144561	Pub Dt:	07/29/2004
Title:	METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

Patent #:	7219826	Issue Dt:	05/22/2007	Application #:	10805768	Filing Dt:	03/22/2004
Publication #:	US20040262367	Pub Dt:	12/30/2004
Title:	METHOD FOR PRODUCING METAL/CERAMIC BONDING SUBSTRATE

Patent #:	NONE	Issue Dt:		Application #:	10829946	Filing Dt:	04/23/2004
Publication #:	US20040261913	Pub Dt:	12/30/2004
Title:	Copper alloy

Patent #:	7238432	Issue Dt:	07/03/2007	Application #:	10916044	Filing Dt:	08/10/2004
Publication #:	US20050048309	Pub Dt:	03/03/2005
Title:	METAL MEMBER COATED WITH METAL LAYERS

Patent #:	7159310	Issue Dt:	01/09/2007	Application #:	10925640	Filing Dt:	08/24/2004
Publication #:	US20050047101	Pub Dt:	03/03/2005
Title:	ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

Patent #:	7340828	Issue Dt:	03/11/2008	Application #:	10948695	Filing Dt:	09/22/2004
Publication #:	US20050060887	Pub Dt:	03/24/2005
Title:	METHOD FOR PRODUCING METAL/CERAMIC BONDING CIRCUIT BOARD

Patent #:	7255931	Issue Dt:	08/14/2007	Application #:	10955172	Filing Dt:	09/29/2004
Publication #:	US20050072547	Pub Dt:	04/07/2005
Title:	ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

Patent #:	7189449	Issue Dt:	03/13/2007	Application #:	10964426	Filing Dt:	10/12/2004
Publication #:	US20050079329	Pub Dt:	04/14/2005
Title:	METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

Patent #:	NONE	Issue Dt:		Application #:	11046614	Filing Dt:	01/28/2005
Publication #:	US20050175773	Pub Dt:	08/11/2005
Title:	Metal/ceramic bonding member and method for producing same

Patent #:	NONE	Issue Dt:		Application #:	11071816	Filing Dt:	03/03/2005
Publication #:	US20050196634	Pub Dt:	09/08/2005
Title:	Metal member and electric contact using same

Patent #:	NONE	Issue Dt:		Application #:	11096301	Filing Dt:	03/31/2005
Publication #:	US20050217823	Pub Dt:	10/06/2005
Title:	Aluminum bonding member and method for producing same

Patent #:	7514022	Issue Dt:	04/07/2009	Application #:	11158947	Filing Dt:	06/21/2005
Publication #:	US20050282006	Pub Dt:	12/22/2005
Title:	COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME

Patent #:	NONE	Issue Dt:		Application #:	11169760	Filing Dt:	06/30/2005
Publication #:	US20060016528	Pub Dt:	01/26/2006
Title:	Copper-based alloy and method of manufacturing same

Patent #:	7304378	Issue Dt:	12/04/2007	Application #:	11208246	Filing Dt:	08/19/2005
Publication #:	US20060043574	Pub Dt:	03/02/2006
Title:	ALUMINUM/CERAMIC BONDING SUBSTRATE

Patent #:	7563408	Issue Dt:	07/21/2009	Application #:	11213986	Filing Dt:	08/30/2005
Publication #:	US20060045790	Pub Dt:	03/02/2006
Title:	COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME

Patent #:	7651785	Issue Dt:	01/26/2010	Application #:	11235416	Filing Dt:	09/26/2005
Publication #:	US20060068220	Pub Dt:	03/30/2006
Title:	TIN-PLATED PRODUCT

Patent #:	7368665	Issue Dt:	05/06/2008	Application #:	11270202	Filing Dt:	11/09/2005
Publication #:	US20060062979	Pub Dt:	03/23/2006
Title:	CIRCUIT BOARD AND A POWER MODULE EMPLOYING THE SAME

Patent #:	7544274	Issue Dt:	06/09/2009	Application #:	11316922	Filing Dt:	12/27/2005
Publication #:	US20060137987	Pub Dt:	06/29/2006
Title:	PLATING DEVICE AND PLATING METHOD

Patent #:	7776426	Issue Dt:	08/17/2010	Application #:	11365887	Filing Dt:	03/02/2006
Publication #:	US20060198994	Pub Dt:	09/07/2006
Title:	CERAMIC CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

Patent #:	NONE	Issue Dt:		Application #:	11378124	Filing Dt:	03/16/2006
Publication #:	US20060216475	Pub Dt:	09/28/2006
Title:	Tin-plated product and method for producing same

Patent #:	7487585	Issue Dt:	02/10/2009	Application #:	11471441	Filing Dt:	06/20/2006
Publication #:	US20060242826	Pub Dt:	11/02/2006
Title:	METHOD OF MANUFACTURING A METAL-CERAMIC CIRCUIT BOARD

Patent #:	7393473	Issue Dt:	07/01/2008	Application #:	11481318	Filing Dt:	07/05/2006
Publication #:	US20070007497	Pub Dt:	01/11/2007
Title:	A METHOD FOR PRODUCING A COMPOSITE PLATED PRODUCT.

Patent #:	7393596	Issue Dt:	07/01/2008	Application #:	11525665	Filing Dt:	09/22/2006
Publication #:	US20070042215	Pub Dt:	02/22/2007
Title:	ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

Patent #:	8011416	Issue Dt:	09/06/2011	Application #:	11528425	Filing Dt:	09/28/2006
Publication #:	US20070017652	Pub Dt:	01/25/2007
Title:	APPARATUS, MOLD, AND METHOD FOR MANUFACTURING METAL-CERAMIC COMPOSITE MEMBER

Patent #:	8039757	Issue Dt:	10/18/2011	Application #:	11605723	Filing Dt:	11/29/2006
Publication #:	US20070089291	Pub Dt:	04/26/2007
Title:	ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

Assignor

DOWA HOLDINGS CO., LTD.

Exec Dt:

11/21/2007

Assignee

DOWA METALTECH CO., LTD.

4-14-1 SOTO-KANDA

CHIYODA-KU, TOKYO, JAPAN

Correspondence name and address
	CLARK & BRODY
	1090 VERMONT AVENUE, NW
	SUITE 250
	WASHINGTON, DC 20005

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