Patent Assignment Details
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Reel/Frame: | 020382/0320 | |
| Pages: | 3 |
| | Recorded: | 01/18/2008 | | |
Attorney Dkt #: | 04173.0549 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/13/2009
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Application #:
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11926614
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Filing Dt:
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10/29/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Title:
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INTERCONNECT METALLIZATION METHOD HAVING THERMALLY TREATED COPPER PLATE FILM WITH REDUCED MICRO-VOIDS
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Assignee
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1-1, SHIBAURA 1-CHOME |
MINATO-KU, TOKYO, JAPAN 105-8001 |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001-4413
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