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Reel/Frame:020384/0795   Pages: 4
Recorded: 01/18/2008
Attorney Dkt #:3002.0094CIP
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/30/2010
Application #:
11939938
Filing Dt:
11/14/2007
Publication #:
Pub Dt:
10/30/2008
Title:
WORKPIECE WITH SEMICONDUCTOR CHIPS AND MOLDING, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A WORKPIECE WITH SEMICONDUCTORS CHIPS
Assignors
1
Exec Dt:
11/21/2007
2
Exec Dt:
11/21/2007
3
Exec Dt:
11/21/2007
4
Exec Dt:
11/21/2007
5
Exec Dt:
11/21/2007
6
Exec Dt:
11/22/2007
7
Exec Dt:
11/21/2007
Assignee
1
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondence name and address
LAWRENCE EISEN (EDELL, SHAPIRO & FINNAN)
1901 RESEARCH BLVD.
SUITE 400
ROCKVILLE, MD 20850

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