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Patent Assignment Details
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Reel/Frame:020422/0669   Pages: 2
Recorded: 01/28/2008
Attorney Dkt #:917-089
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12020659
Filing Dt:
01/28/2008
Publication #:
Pub Dt:
08/14/2008
Title:
CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL
Assignors
1
Exec Dt:
12/17/2007
2
Exec Dt:
12/17/2007
Assignee
1
16-2 OAZA SAYAMAGAHARA, IRUMA-SHI
SAITAMA, JAPAN 358-8501
Correspondence name and address
KING & SCHICKLI, PLLC
247 NORTH BROADWAY
LEXINGTON, KY 40507

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