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Reel/Frame:020452/0523   Pages: 6
Recorded: 01/31/2008
Attorney Dkt #:ANO-010/US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/07/2011
Application #:
12023921
Filing Dt:
01/31/2008
Publication #:
Pub Dt:
08/06/2009
Title:
WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE
Assignors
1
Exec Dt:
01/31/2008
2
Exec Dt:
01/31/2008
3
Exec Dt:
01/31/2008
4
Exec Dt:
01/31/2008
Assignee
1
CANNON'S COURT 22, VICTORIA STREET
HAMILTON HM12, BERMUDA
Correspondence name and address
JOSHUA D. ISENBERG
809 CORPORATE WAY
FREMONT, CA 94539

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