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Reel/Frame:020480/0814   Pages: 6
Recorded: 02/07/2008
Attorney Dkt #:8405 ETCH/DRIE
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/12/2010
Application #:
11974502
Filing Dt:
10/11/2007
Publication #:
Pub Dt:
04/16/2009
Title:
TIME-BASED WAFER DE-CHUCKING FROM AN ELECTROSTATIC CHUCK HAVING SEPARATE RF BIAS AND DC CHUCKING ELECTRODES
Assignors
1
Exec Dt:
12/03/2007
2
Exec Dt:
11/15/2007
3
Exec Dt:
11/20/2007
Assignee
1
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondence name and address
APPLIED MATERIALS, INC.
P. O. BOX 450 A
SANTA CLARA, CA 95052

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