Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020492/0080 | |
| Pages: | 3 |
| | Recorded: | 02/11/2008 | | |
| Attorney Dkt #: | 2780-24CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11936596
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Filing Dt:
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11/07/2007
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Publication #:
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Pub Dt:
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10/02/2008
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Title:
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SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME
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Assignee
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| NO. 65, GUANGFU NO. RD., HUKOU TOWNSHIP |
| HSINCHU COUNTY 303, TAIWAN |
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Correspondence name and address
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LAWRENCE A. MAXHAM
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THE MAXHAM FIRM
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9330 SCRANTON ROAD, SUITE 350
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SAN DIEGO, CA 92121
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