Patent Assignment Details
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| Reel/Frame: | 020614/0361 | |
| Pages: | 3 |
| | Recorded: | 03/03/2008 | | |
| Attorney Dkt #: | MURA3005CIP/REF |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007406
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Filing Dt:
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01/10/2008
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Publication #:
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Pub Dt:
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06/19/2008
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Title:
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Method of manufacturing wafer level chip size package
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Assignee
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| 38-32, MINAMIMACHI 5-CHOME |
| FUCHU-SHI, TOKYO, JAPAN |
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Correspondence name and address
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RICHARD E. FICHTER
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BACON & THOMAS, PLLC
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625 SLATERS LANE FOURTH FLOOR
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ALEXANDRIA, VA 22314
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