Patent Assignment Details
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| Reel/Frame: | 020615/0717 | |
| Pages: | 5 |
| | Recorded: | 03/07/2008 | | |
| Attorney Dkt #: | TTCA-262 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12044191
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Filing Dt:
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03/07/2008
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Publication #:
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Pub Dt:
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09/10/2009
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Title:
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VOID-FREE COPPER FILLING OF RECESSED FEATURES USING A SMOOTH NON-AGGLOMERATED COPPER SEED LAYER
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Assignee
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| AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
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Correspondence name and address
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AUDUNN LUDVIKSSON
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4350 W CHANDLER BLVD
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SUITE 10
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CHANDLER, AZ 85226
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