Patent Assignment Details
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| Reel/Frame: | 020651/0308 | |
| Pages: | 5 |
| | Recorded: | 03/14/2008 | | |
| Attorney Dkt #: | 18151-036001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/29/2011
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Application #:
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11957030
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Filing Dt:
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12/14/2007
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Publication #:
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Pub Dt:
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07/03/2008
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Title:
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PACKING BOARD FOR ELECTRONIC DEVICE, PACKING BOARD MANUFACTURING METHOD, SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE MANUFACTURING METHOD, AND MOBILE DEVICE
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Assignee
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| 5-5, KEIHAN-HONDORI 2-CHOME, MORIGUCHI-SHI |
| OSAKA, JAPAN |
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Correspondence name and address
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SAMUEL BORODACH
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FISH & RICHARDSON P.C.
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P.O.BOX 1022
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MINNEAPOLIS, MN 55440-1022
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