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Patent Assignment Details
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Reel/Frame:020698/0659   Pages: 3
Recorded: 03/21/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11990950
Filing Dt:
03/19/2008
Publication #:
Pub Dt:
05/14/2009
Title:
Molded circuit component and process for producing the same
Assignors
1
Exec Dt:
03/10/2008
2
Exec Dt:
03/10/2008
Assignee
1
11-14, KUGAHARA 2-CHOME, OTA-KU
TOKYO, 146-0085, JAPAN
Correspondence name and address
FRANK J. JORDAN, ESQ.
JORDAN AND HAMBURG LLP
CHANIN BUILDING
122 EAST 42ND STREET, SUITE 4000
NEW YORK, NY 10168

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