Patent Assignment Details
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| Reel/Frame: | 020761/0127 | |
| Pages: | 3 |
| | Recorded: | 04/07/2008 | | |
| Attorney Dkt #: | MEG01-003-E06 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12098469
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Filing Dt:
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04/07/2008
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Publication #:
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Pub Dt:
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08/07/2008
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Title:
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Low fabrication cost, fine pitch and high reliability solder bump
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Assignee
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| ROOM 301, NO. 47, PARK 2ND RD., |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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MEGICA CORPORATION
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SCIENCE-BASED INDUSTRIAL PARK
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ROOM 301/302, NO. 47, PARK 2ND RD.
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HSINCHU, 300 TAIWAN
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