Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 020801/0482 | |
| Pages: | 5 |
| | Recorded: | 04/14/2008 | | |
| Attorney Dkt #: | 27-504 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2011
|
Application #:
|
12055634
|
Filing Dt:
|
03/26/2008
|
|
Publication #:
|
|
Pub Dt:
|
10/01/2009
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE-IN-FILM ADHESIVE
|
|
|
Assignee
|
|
|
|
|
| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
|
|
Correspondence name and address
|
| |
MIKIO ISHIMARU
|
| |
LAW OFFICES OF MIKIO ISHIMARU
|
| |
333 W. EL CAMINO REAL, SUITE # 330
|
| |
SUNNYVALE, CA 94087
|
Search Results as of:
05/16/2024 05:32 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
