Patent Assignment Details
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| Reel/Frame: | 020832/0477 | |
| Pages: | 3 |
| | Recorded: | 04/18/2008 | | |
| Attorney Dkt #: | MR3579-99 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12081145
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Filing Dt:
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04/11/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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Semiconductor package structure with heat sink
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Assignee
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| NO. 26, DATONG RD. |
| HSINCHU INDUSTRIAL PARK, HUKOU |
| HSINCHU 30352, TAIWAN R.O.C. |
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Correspondence name and address
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MORTON J. ROSENBERG, ESQ.
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE
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SUITE 101
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ELLICOTT CITY, MD 21043
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