Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 020856/0455 | |
| Pages: | 2 |
| | Recorded: | 04/25/2008 | | |
| Attorney Dkt #: | 000027-000900US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/29/2010
|
Application #:
|
12109597
|
Filing Dt:
|
04/25/2008
|
|
Publication #:
|
|
Pub Dt:
|
08/27/2009
| | | | |
|
Title:
|
CHIP SCALE PACKAGE FABRICATION METHODS
|
|
|
Assignee
|
|
|
|
|
| PLANT NO. 1, LANE 18, SAN ZHUANG ROAD |
| SONGJIANG EXPORT ZONE, SHANGHAI, CHINA |
|
|
Correspondence name and address
|
| |
FOUNTAINHEAD LAW GROUP, PC
|
| |
900 LAFAYETTE STREET
|
| |
SUITE 509
|
| |
SANTA CLARA, CA 95050
|
Search Results as of:
05/14/2024 05:41 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
