Patent Assignment Details
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| Reel/Frame: | 020856/0570 | |
| Pages: | 2 |
| | Recorded: | 04/25/2008 | | |
| Attorney Dkt #: | 000027-001000US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/2009
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Application #:
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12109617
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Filing Dt:
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04/25/2008
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Title:
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WIRE BONDED CHIP SCALE PACKAGE FABRICATION METHODS
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Assignee
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| PLANT NO. 1, LANE 18, SAN ZHUANG ROAD |
| SONGJIANG EXPORT ZONE, SHANGHAI, CHINA |
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Correspondence name and address
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FOUNTAINHEAD LAW GROUP, PC
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900 LAFAYETTE STREET
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SUITE 509
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SANTA CLARA, CA 95050
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