Patent Assignment Details
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Reel/Frame: | 020901/0762 | |
| Pages: | 4 |
| | Recorded: | 05/05/2008 | | |
Attorney Dkt #: | X2007.0272 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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12001307
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Filing Dt:
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12/11/2007
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Publication #:
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Pub Dt:
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08/21/2008
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Title:
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method of manufacturing semiconductor devices encapsulated in chip size packages
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Assignee
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10-1, NAKAZAWA-CHO, NAKA-KU |
HAMAMATSU-SHI |
SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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MICHAEL J. SCHEER
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DICKSTEIN SHAPIRO LLP
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1177 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036
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