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Patent Assignment Details
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Reel/Frame:021011/0986   Pages: 2
Recorded: 05/28/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/03/2012
Application #:
12078269
Filing Dt:
03/28/2008
Publication #:
Pub Dt:
10/02/2008
Title:
PACKAGING MATERIAL FOR FLAT ELECTROCHEMICAL CELL
Assignors
1
Exec Dt:
03/19/2008
2
Exec Dt:
03/19/2008
3
Exec Dt:
03/19/2008
4
Exec Dt:
03/24/2008
Assignees
1
1-1, ICHIGAYA KAGACHO 1-CHOME
SHINJUKU-KU, TOKYO 162-8001, JAPAN
2
5-2, HIGASHI-SHIMBASHI 1-CHOME
MINATO-KU, TOKYO 105-7117, JAPAN
Correspondence name and address
KENDREW H. COLTON
FITCH, EVEN, TABIN & FLANNERY
ONE LAFAYETTE CENTRE
1120 - 20TH STREET, NW, SUITE 750 SOUTH
WASHINGTON, DC 20036

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