Patent Assignment Details
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| Reel/Frame: | 021036/0398 | |
| Pages: | 5 |
| | Recorded: | 06/04/2008 | | |
| Attorney Dkt #: | 78845 (119-23 US) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2010
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Application #:
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12132641
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Filing Dt:
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06/04/2008
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Publication #:
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Pub Dt:
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03/05/2009
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Title:
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WAFER LEVEL CHIP SIZE PACKAGE FOR MEMS DEVICES AND METHOD FOR FABRICATING THE SAME
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Assignee
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| 11 B/C, SUCHUN INDUSTRIAL SQUARE |
| 428 XINGLONG STREET |
| SUZHOU INDUSTRIAL PARK, CHINA 215126 |
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Correspondence name and address
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CHRISTOPHER F. REGAN
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1901 S. HARBOR CITY BLVD
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STE. 507
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MELBOURNE, FL 32901
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