Patent Assignment Details
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| Reel/Frame: | 021083/0476 | |
| Pages: | 2 |
| | Recorded: | 06/02/2008 | | |
| Attorney Dkt #: | 4041J-001453 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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12156518
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Filing Dt:
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06/02/2008
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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METHOD OF MANUFACTURING ELECTRONIC DEVICE HAVING RESIN-MOLDED CASE AND MOLDING TOOL FOR FORMING RESIN-MOLDED CASE
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Assignee
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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Correspondence name and address
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H. KEITH MILLER, ESQ.
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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