Patent Assignment Details
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| Reel/Frame: | 021088/0254 | |
| Pages: | 4 |
| | Recorded: | 06/04/2008 | | |
| Attorney Dkt #: | 137229 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/15/2011
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Application #:
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12086029
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Filing Dt:
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06/04/2008
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Publication #:
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Pub Dt:
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02/26/2009
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Title:
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DOUBLE-DISC GRINDING MACHINE, STATIC PRESSURE PAD, AND DOUBLE-DISC GRINDING METHOD USING THE SAME FOR SEMICONDUCTOR WAFER
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Assignee
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| 6-2, OHTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM P. BERRIDGE
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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