Patent Assignment Details
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| Reel/Frame: | 021171/0153 | |
| Pages: | 3 |
| | Recorded: | 06/30/2008 | | |
| Attorney Dkt #: | 81804(304222) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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12153111
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Filing Dt:
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05/14/2008
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Publication #:
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Pub Dt:
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11/20/2008
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Title:
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POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD
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Assignees
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| 11-1, KAMEIDO 9-CHOME, KOTO-KU |
| TOKYO, JAPAN |
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| 2647 HAYAKAWA |
| AYASE-SHI, KANAGAWA, JAPAN |
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Correspondence name and address
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EDWARDS ANGELL PALMER & DODGE LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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