Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021181/0251 | |
| Pages: | 2 |
| | Recorded: | 07/01/2008 | | |
| Attorney Dkt #: | AOS-0507 |
| Conveyance: | CHANGE OF ASSIGNEE'S ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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11318300
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Filing Dt:
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12/22/2005
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Publication #:
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Pub Dt:
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04/19/2007
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Title:
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VERTICAL PACKAGED IC DEVICE MODULES WITH INTERCONNECTED 3D LAMINATES DIRECTLY CONTACTS WAFER BACKSIDE
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Assignee
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| CANNON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM12, BERMUDA |
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Correspondence name and address
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BO-IN LIN
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13445 MANDOLI DRIVE
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LOS ALTOS HILLS, CA 94022
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