Patent Assignment Details
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Reel/Frame: | 021206/0423 | |
| Pages: | 2 |
| | Recorded: | 07/01/2008 | | |
Attorney Dkt #: | 065933-0390 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/28/2011
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Application #:
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12109811
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Filing Dt:
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04/25/2008
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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PACKAGING BOARD, REWIRING, ROUGHENED CONDUCTOR FOR SEMICONDUCTOR MODULE OF A PORTABLE DEVICE, AND MANUFACTURING METHOD THEREFOR
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Assignee
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5-5, KEIHAN-HONDORI 2-CHOME, MORIGUCHI-SHI |
OSAKA, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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