Patent Assignment Details
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| Reel/Frame: | 021238/0290 | |
| Pages: | 2 |
| | Recorded: | 07/15/2008 | | |
| Attorney Dkt #: | Q109254 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12160936
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Filing Dt:
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07/15/2008
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Publication #:
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Pub Dt:
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07/29/2010
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Title:
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SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT USING SAME
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Assignee
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| 2-1 SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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04/27/2024 05:11 PM
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