Patent Assignment Details
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| Reel/Frame: | 021244/0790 | |
| Pages: | 5 |
| | Recorded: | 07/16/2008 | | |
| Attorney Dkt #: | HKY-18471 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/05/2010
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Application #:
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12173985
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Filing Dt:
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07/16/2008
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Publication #:
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Pub Dt:
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01/22/2009
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Title:
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SOLDER BUMP FORMING METHOD
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Assignee
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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RANKIN HILL AND CLARK
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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