Patent Assignment Details
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Reel/Frame: | 021318/0584 | |
| Pages: | 5 |
| | Recorded: | 07/30/2008 | | |
Attorney Dkt #: | 27-165 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/25/2008
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Application #:
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11306627
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Filing Dt:
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01/04/2006
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Publication #:
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Pub Dt:
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07/12/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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