Patent Assignment Details
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| Reel/Frame: | 021355/0794 | |
| Pages: | 3 |
| | Recorded: | 08/07/2008 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11814129
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Filing Dt:
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07/17/2007
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Publication #:
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Pub Dt:
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10/23/2008
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Title:
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Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming Material
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Assignee
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO 1418584, JAPAN |
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Correspondence name and address
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ROTHWELL, FIGG, ERNST & MANBECK
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SUITE 800
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1425 K ST., N.W.
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WASHINGTON, DC 20005
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