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Total properties:
16
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Patent #:
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Issue Dt:
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03/31/1998
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Application #:
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08527798
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Filing Dt:
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09/13/1995
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Title:
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MULTI-STAGE TELESCOPING STRUCTURE
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Patent #:
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Issue Dt:
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09/07/1999
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Application #:
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08707932
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Filing Dt:
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09/10/1996
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Title:
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CATCH CUP CLEANING SYSTEM
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Patent #:
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Issue Dt:
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07/18/2000
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Application #:
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08938396
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Filing Dt:
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09/26/1997
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Title:
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HOT PLATE OVEN FOR PROCESSING FLAT PANEL DISPLAYS AND LARGE WAFERS
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Patent #:
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Issue Dt:
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01/23/2001
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Application #:
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08988288
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Filing Dt:
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12/10/1997
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Title:
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METHOD AND APPARATUS FOR ADAPTIVE PROCESS CONTROL OF CRITICAL DIMENSIONS DURING SPIN COATING PROCESS
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Patent #:
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Issue Dt:
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06/19/2001
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Application #:
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09221060
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Filing Dt:
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12/28/1998
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Title:
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YIELD AND LINE WIDTH PERFORMANCE FOR LIQUID POLYMERS AND OTHER MATERIALS
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09245445
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Filing Dt:
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02/05/1999
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Title:
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DIRECT SKEW CONTROL AND INTERLOCK OF GANTRY
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09275360
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Filing Dt:
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03/23/1999
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Title:
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PLASMA DEPOSITION OF SPIN CHUCKS TO REDUCE CONTAMINATION OF SILICON WAFERS
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Patent #:
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Issue Dt:
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11/27/2001
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Application #:
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09360851
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Filing Dt:
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07/24/1999
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Title:
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LIQUID DISPENSING SYSTEMS AND METHODS
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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09521026
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Filing Dt:
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03/07/2000
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Title:
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RECIPE CASCADING IN A WAFER PROCESSING SYSTEM
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Patent #:
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Issue Dt:
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10/16/2001
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Application #:
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09522249
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Filing Dt:
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03/09/2000
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Title:
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Liquid dispensing systems and methods
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Patent #:
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Issue Dt:
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03/08/2005
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Application #:
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09602527
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Filing Dt:
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06/23/2000
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Title:
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ROBOT PRE-POSITIONING IN A WAFER PROCESSING SYSTEM
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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09624712
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Filing Dt:
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07/25/2000
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Title:
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METHOD FOR AN IMPROVED DEVELOPING PROCESS IN WAFER PHOTOLITHOGRAPHY
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Patent #:
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Issue Dt:
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12/30/2003
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Application #:
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09800060
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Filing Dt:
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03/05/2001
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Publication #:
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Pub Dt:
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12/12/2002
| | | | |
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Title:
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YIELD AND LINE WIDTH PERFORMANCE FOR LIQUID POLYMERS AND OTHER MATERIALS
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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09874073
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Filing Dt:
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06/04/2001
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Publication #:
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Pub Dt:
|
11/22/2001
| | | | |
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Title:
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PLASMA DEPOSITION OF SPIN CHUCKS TO REDUCE CONTAMINATION OF SILICON WAFERS
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|
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Patent #:
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Issue Dt:
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12/16/2003
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Application #:
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10013785
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Filing Dt:
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12/11/2001
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Publication #:
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Pub Dt:
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08/22/2002
| | | | |
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Title:
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METHOD FOR TWO DIMENSIONAL ADAPTIVE PROCESS CONTROL OF CRITICAL DIMENSIONS DURING SPIN COATING PROCESS
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10618175
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Filing Dt:
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07/11/2003
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Publication #:
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Pub Dt:
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06/03/2004
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Title:
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APPARATUS FOR PROCESSING WAFERS
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