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Reel/Frame:021367/0532   Pages: 6
Recorded: 08/11/2008
Attorney Dkt #:27-540
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/23/2011
Application #:
12185063
Filing Dt:
08/01/2008
Publication #:
Pub Dt:
02/04/2010
Title:
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
Assignors
1
Exec Dt:
07/28/2008
2
Exec Dt:
07/28/2008
3
Exec Dt:
07/28/2008
4
Exec Dt:
07/28/2008
5
Exec Dt:
07/28/2008
6
Exec Dt:
07/28/2008
7
Exec Dt:
07/28/2008
Assignee
1
10 ANG MO KIO STREET 65
TECHPOINT #05-17/20
SINGAPORE, SINGAPORE 569059
Correspondence name and address
LAW OFFICES OF MIKIO ISHIMARU
333 W. EL CAMINO REAL
SUITE 330
SUNNYVALE, CA 94087

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